Singapore's Hanic Launches IC Design and Advanced Packaging Hub in Penang, Creating 60+ High-Value Semiconductor Jobs

Singapore-based semiconductor firm Hanic has established a new hub in Penang, Malaysia, specializing in IC design and advanced packaging.

The center targets high-growth sectors like AI-driven chip architectures and heterogeneous integration, offering a seamless one-stop solution to cut time-to-market for data centers, edge AI, automotive, and communications industries.

Strengthening Penang's Semiconductor Ecosystem

With five decades of electronics manufacturing excellence, Penang solidifies its reputation as the Silicon Valley of the East through this strategic expansion.

The initiative aligns with Malaysia's National Semiconductor Strategy, boosting front-end design and advanced packaging competencies via programs like Penang Silicon Design @5KM+.

Job Creation and Economic Impact

Hanic's hub will generate over 60 high-value engineering roles in SoC designs, verifications, physical designs, DFT, and 2.5D/3D packaging.

Chief Minister Chow Kon Yeow emphasized that the project enhances innovation capacity, creates talent opportunities, and drives technological spillovers for the state.

Dr Oh Ser Wah, Hanic's General Manager, praised Penang's synergies and the firm's pioneering 3D IC delivery in the region.

Future Roadmap and Innovations

Backed by InvestPenang, Hanic commits to nurturing local talent and leading advancements in computing performance.

The hub integrates design, testing, and manufacturing ecosystems, positioning Malaysia at the forefront of the semiconductor revolution.

Hiring is underway, with partnerships in discussion to shape the advanced packaging roadmap.

This development promises lasting impacts on regional tech leadership and economic growth.