VSMC Celebrates Breaking Ground on 300mm Fab in Singapore

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Initial production slated for 2027, expected output of 55,000 300mm wafers per month in 2029SINGAPORE, Dec.04, 2024 (GLOBE NEWSWIRE) -- VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC), the joint venture formed in September, 2024 by Vanguard International Semiconductor Corporation (VIS, TPEx 5347) and NXP Semiconductors N.V.(NXP, NASDAQ: NXPI) today celebrated breaking ground at the site of the joint venture’s new 300mm wafer manufacturing facility in Tampines, Singapore.

"Singapore will continue to invest in talent development, R&D, and decarbonization solutions to enhance our competitiveness and strengthen Singapore’s semiconductor ecosystem.” Construction of the VSMC fab is on-track, with initial production slated to begin in 2027.

With an expected output of 55,000 300mm wafers per month in 2029, the joint venture will create approximately 1,500 jobs while contributing to the development of the upstream and downstream supply chains, contributing to Singapore and the global semiconductor ecosystem.

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Author / Journalist: NXP USA, Inc.

Category: Technology

Markets: ChinaSingaporeTaiwan

Topics: NL0009538784 Nasdaq:NXPI

Source Website Secure: Yes (HTTPS)

News Sentiment: Neutral

Fact Checked: Legitimate

Article Type: News Report

Published On: 2024-12-04 @ 06:00:00 (2 weeks ago)

News Timezone: GMT +8:00

News Source URL: globenewswire.com

Language: English

Article Length: 952 words

Reading Time: 6 minutes read

Sentences: 33 lines

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Copyright Owner: © GlobeNewswire

News ID: 24112779

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