Using 2D materials on chips without destroying the wiring

Quick Summary:

2D materials are typically made at temperatures that wreck silicon chips.

Kim’s team did both, building a 3D chip out of vertically stacked 2D semiconductors.

Another way is building 3D chips, which squeeze more transistors into the same area without making transistors smaller.

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Article Details

Author / Journalist: Jacek Krywko

Category: Technology

Markets: United StatesSouth Korea

Topics: Atomically thin materials 2D transistors Processors Science Materials science

Source Website Secure: Yes (HTTPS)

News Sentiment: Neutral

Fact Checked: Legitimate

Article Type: News Report

Published On: 2025-01-02 @ 16:05:17 (5 days ago)

News Timezone: GMT -5:00

News Source URL: arstechnica.com

Language: English

Article Length: 113 words

Reading Time: 1 minutes read

Sentences: 69 lines

Sentence Length: 2 words per sentence (average)

Platforms: Desktop Web, Mobile Web, iOS App, Android App

Copyright Owner: © Ars Technica

News ID: 24821548

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About Ars Technica

Main Topics: Technology

Official Website: arstechnica.com

Update Frequency: 19 posts per day

Year Established: 1998

Headquarters: United States

News Last Updated: 12 hours ago

Coverage Areas: United States

Ownership: Independent Company

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Publisher ID: #32

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