US Signs Off on $6.6bn Chips Deal With TSMC, Others Coming

Quick Summary:

Commerce Dept finalises subsidy for its plant in Arizona; deals with Samsung, Intel and Micron to follow before Trump returns to White House

The post US Signs Off on $6.6bn Chips Deal With TSMC, Others Coming appeared first on Asia Financial.

Commerce has allocated $36 billion for chips projects including $6.4 billion for Samsung in Texas, $8.5 billion for Intel  and $6.1 billion for Micron Technology.

---

More Pictures

---

Read Quick SummarySave Time

or

Article Details

Author / Journalist: Jim Pollard

Category: InvestingBusiness

Markets: Hong KongAustraliaChinaTaiwanThailandUnited States

Topics: Market Insights Asia Fintech Insights North Asia Fintech ESG World Semiconductors AI China-US Economic Ties

Source Website Secure: Yes (HTTPS)

News Sentiment: Neutral

Fact Checked: Legitimate

Article Type: News Report

Published On: 2024-11-15 @ 12:12:51 (12 hours ago)

News Timezone: GMT +8:00

News Source URL: asiafinancial.com

Language: English

Article Length: 546 words

Reading Time: 4 minutes read

Sentences: 24 lines

Sentence Length: 23 words per sentence (average)

Platforms: Desktop Web, Mobile Web, iOS App, Android App

Copyright Owner: © Asia Financial

News ID: 23602203

View Article Analysis

About Asia Financial

Main Topics: InvestingBusiness

Official Website: asiafinancial.com

Update Frequency: 4 posts per day

Year Established: 1990

Headquarters: Hong Kong

News Last Updated: 11 hours ago

Coverage Areas: Hong Kong

Ownership: Independent Company

Publication Timezone: GMT +8:00

Content Availability: Worldwide

News Language: English

RSS Feed: Available (XML)

API Access: Available (JSON, REST)

Website Security: Secure (HTTPS)

Publisher ID: #86

Publisher Details

Frequently Asked Questions