US plans up to $2.2 billion in funding for packaging computer chips

Quick Summary:

It's a major thrust in US efforts to stay ahead of China.

TSMC is slated to receive federal grants for chip production in Arizona, but it hasn’t said it will shift any packaging services from Taiwan.

But US companies could use federal money to help stay on the cutting edge, said Jan Vardaman, president of TechSearch International, a consultancy focusing on chip packaging.

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Category: EconomyBusiness

Markets: SingaporeChinaJapanSouth KoreaMalaysiaMexicoPhilippinesTaiwanVietnam

Topics: Called Efforts Chip Packaging Chips Locascio Companies Funding Technology Research Plans

Source Website Secure: Yes (HTTPS)

News Sentiment: Neutral

Fact Checked: Legitimate

Article Type: News Report

Published On: 2024-07-10 @ 08:38:00 (1 weeks ago)

News Timezone: GMT +8:00

News Source URL: straitstimes.com

Language: English

Article Length: 830 words

Reading Time: 5 minutes read

Sentences: 32 lines

Sentence Length: 26 words per sentence (average)

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Copyright Owner: © The Straits Times

News ID: 21559559

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