US finalises US$6.6b chips award for TSMC ahead of Trump return

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WASHINGTON, Nov 16 — The US Commerce Department said yesterday it has finalised a US$6.6 billion (RM29.5 billion) govern...

The binding contract - after a preliminary agreement announced in April - is the first major award to be completed under the US$52.7 billion program created in 2022.

The TSMC award also includes up to US$5 billion in low-cost government loans.

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Article Details

Category: EconomyBusiness

Markets: MalaysiaChinaTaiwanUnited States

Topics: TSMC

Source Website Secure: Yes (HTTPS)

News Sentiment: Negative

Fact Checked: Legitimate

Article Type: News Report

Published On: 2024-11-16 @ 09:39:47 (7 hours ago)

News Timezone: GMT +8:00

News Source URL: malaymail.com

Language: English

Article Length: 487 words

Reading Time: 3 minutes read

Sentences: 21 lines

Sentence Length: 24 words per sentence (average)

Platforms: Desktop Web, Mobile Web, iOS App, Android App

Copyright Owner: © Malay Mail

News ID: 23608582

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About Malay Mail

Main Topics: EconomyBusiness

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