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TechInsights Releases Initial Findings of its NVIDIA Blackwell HGX B200 Platform Teardown

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TechInsights Releases Initial Findings of its NVIDIA Blackwell HGX B200 Platform Teardown - GlobeNewswire

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Findings reveal high-bandwidth memory provider and advanced packaging design architectureOTTAWA, Ontario, April 14, 2025 (GLOBE NEWSWIRE) -- TechInsights today released early-stage findings of its teardown analysis of the NVIDIA Blackwell HGX B200 platform delivering advanced artificial intelligence (AI) and high-performance computing (HPC) performance in the data center.

TechInsights reports SK hynix is the high-bandwidth memory (HBM3E) supplier and the GB100 graphics processing unit (GPU) implements TSMC’s latest advanced packaging architecture.

"The Blackwell product line is the world’s most advanced chipset that NVIDIA developed for the generative AI’ era.” HBM3e Supplier The GB100 features eight HBMs co-packaged with two reticles worth of TSMC silicon.

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Article Details

Author / Journalist: TechInsights Inc.

Category: Technology

Markets:

Topics:

Source Website Secure: Yes (HTTPS)

News Sentiment: Neutral

Fact Checked: Legitimate

Article Type: News Report

Published On: 2025-04-14 @ 14:00:00 (6 days ago)

News Timezone: GMT +8:00

News Source URL: globenewswire.com

Language: English

Article Length: 597 words

Reading Time: 4 minutes read

Sentences: 26 lines

Sentence Length: 23 words per sentence (average)

Platforms: Desktop Web, Mobile Web, iOS App, Android App

Copyright Owner: © GlobeNewswire

News ID: 27867343

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Main Topics: Technology

Official Website: globenewswire.com

Year Established: 1998

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News Last Updated: 1 days ago

Coverage Areas: China

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Publisher ID: #116

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