Tech war: upcoming Huawei chip unit event stokes speculation over breakthrough

Quick Summary:

A conference next month by Huawei’s secretive chip design unit HiSilicon has fanned speculation that a sanctions-busting breakthrough may be announced.

Washington tightened trade restrictions in August 2020 to prevent HiSilicon-designed chips from being manufactured by major chip foundries such as Taiwan Semiconductor Manufacturing Company (TSMC).

A Kirin 9000s chip taken from a Huawei Mate 60 Pro smartphone, arranged in Ottawa, Ontario, Canada, Sept.3, 2023.

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Article Details

Author / Journalist: Iris Deng

Category: Technology

Markets: Hong KongCanadaChinaTaiwan

Topics: Hisilicon’s Products Mate Chip Statement Huawei Hisilicon Chips Cent Smartphones Last

Source Website Secure: Yes (HTTPS)

News Sentiment: Neutral

Fact Checked: Legitimate

Article Type: News Report

Published On: 2024-08-20 @ 21:00:13 (3 hours ago)

News Timezone: GMT +8:00

News Source URL: scmp.com

Language: English

Article Length: 551 words

Reading Time: 4 minutes read

Sentences: 20 lines

Sentence Length: 28 words per sentence (average)

Platforms: Desktop Web, Mobile Web, iOS App, Android App

Copyright Owner: © SCMP

News ID: 22179722

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