Shenzhen government to raise US$964 million with ‘dim sum’ bond issue in Hong Kong

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Shenzhen government to raise US$964 million with ‘dim sum’ bond issue in Hong Kong - SCMP

Quick Summary:

The fourth offering in the last four years, which will fund an array of infrastructure projects, brings total funds raised to US$3 billion.

The two-year tranches will be used for establishing facilities for secondary schools, while the three-year bonds will be green bonds to invest in underground trains and other infrastructure to help cut carbon emissions.

The move also marks another example of Hong Kong’s role as a fundraising centre for Shenzhen, which is seen as the Silicon Valley of China.