Samsung to launch 3D HBM chip packaging service in 2024

Quick Summary:

To do so, its advanced packaging team will vertically interconnect HBM chips produced at its memory business division with GPUs assembled for fabless companies by its foundry unit.“3D packaging reduces power consumption and processing delays, improving the quality of electrical signals of semiconductor chips,” said a Samsung Electronics official.

SAN JOSE -- Samsung Electronics Co.will launch three-dimensional (3D) packaging services for high-bandwidth memory (HBM) within the year, a technology expected to be introduced for the artificial intelligence chip’s sixth-generation model HBM4 due in 2025, according to the company and industry sources.

VERTICAL CONNECTIONSamsung’s latest packaging technology features HBM chips stacked vertically on top of a GPU to further accelerate data learning and inference processing, a technology regarded as a game changer in the fast-growing AI chip market.

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Category: Economy

Markets: South KoreaIndiaTaiwan

Topics: Market Technology Chips Latest Packaging Samsung Electronics Company Memory Expected Advanced

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Published On: 2024-06-16 @ 13:43:23 (1 weeks ago)

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News Source URL: kedglobal.com

Language: English

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