Global payment infrastructure leader Primer has partnered with Singapore-based unified commerce platform HitPay to revolutionize the way merchants in Southeast Asia access international markets.
This strategic collaboration, announced on January 13, 2026, aims to provide faster and more seamless solutions for businesses looking to expand globally.
Breaking Down Barriers for Regional Merchants
The partnership between Primer and HitPay is set to address key challenges faced by merchants in Southeast Asia, such as complex payment systems and limited access to global markets.
By combining Primer’s advanced payment infrastructure with HitPay’s regional expertise, the duo promises to simplify cross-border transactions for small and medium-sized enterprises (SMEs).
A Growing FinTech Ecosystem in Southeast Asia
Southeast Asia has emerged as a hotbed for FinTech innovation, with Singapore leading as a financial hub fostering partnerships like this one.
HitPay, founded to empower SMEs with accessible payment solutions, has a history of impactful collaborations, including a 2022 Series A funding round of $15.75 million led by Tiger Global, as reported by TechNode Global.
This latest alliance with Primer builds on HitPay’s mission to support regional businesses, following previous partnerships with firms like Yuno and NPCI International for payment integrations.
Impact and Future Prospects
The impact of this partnership could be transformative, enabling thousands of merchants to scale operations beyond local borders with greater ease and efficiency.
Looking ahead, this collaboration may set a precedent for how FinTech firms can work together to tackle the globalization challenges faced by SMEs in emerging markets.
Industry experts predict that such partnerships will drive economic growth in Southeast Asia by fostering digital adoption and financial inclusion.
As Primer and HitPay roll out their joint solutions, the focus will likely remain on innovation, ensuring merchants stay competitive in a rapidly evolving digital economy.
Alfred Lee
