Nvidia Supplier TSMC To Double Advanced Chip Packaging Capacity As AI Demand From Microsoft, Amazon Soars

Quick Summary:

Taiwan Semiconductor Mfg.Co.Ltd.(NYSE:TSM) is set to double its production capacity for advanced packaging, a move driven by the increasing demand for artificial intelligence chips from major players like Nvidia Corp.(NASDAQ:NVDA), Microsoft Corp (NASDAQ:MSFT), Amazon.com Inc.(NASDAQ:AMZN), and Alphabet Inc (NASDAQ:GOOGL) (NASDAQ:GOOG).

What Happened: TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging is experiencing a surge in demand, particularly from AI chip manufacturers and cloud service providers, reported CNA.

TSMC is expected to double its production capacity in 2025, with Nvidia projected to occupy over 50% of the capacity.Despite ...

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Category: Technology

Markets: United StatesTaiwan

Topics: TSM US67066G1040 Kaustubh Bagalkote Global US38259P5089 Benzinga Artificial intelligence Markets US5949181045 MSFT NVDA US38259P7069 GOOGL AMZN Equities US8740391003 Tech News US0231351067 GOOG

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Article Type: News Report

Published On: 2024-11-04 @ 08:52:54 (1 days ago)

News Timezone: GMT +8:00

News Source URL: benzinga.com

Language: English

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