Nvidia Supplier TSMC To Double Advanced Chip Packaging Capacity As AI Demand From Microsoft, Amazon Soars

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Nvidia Supplier TSMC To Double Advanced Chip Packaging Capacity As AI Demand From Microsoft, Amazon Soars - Benzinga

Quick Summary:

Taiwan Semiconductor Mfg.Co.Ltd.(NYSE:TSM) is set to double its production capacity for advanced packaging, a move driven by the increasing demand for artificial intelligence chips from major players like Nvidia Corp.(NASDAQ:NVDA), Microsoft Corp (NASDAQ:MSFT), Amazon.com Inc.(NASDAQ:AMZN), and Alphabet Inc (NASDAQ:GOOGL) (NASDAQ:GOOG).

What Happened: TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging is experiencing a surge in demand, particularly from AI chip manufacturers and cloud service providers, reported CNA.

TSMC is expected to double its production capacity in 2025, with Nvidia projected to occupy over 50% of the capacity.Despite ...