Nvidia Continues Strong Demand for Taiwan Semiconductor's Advanced Packaging Despite Technology Shifts

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Nvidia Continues Strong Demand for Taiwan Semiconductor's Advanced Packaging Despite Technology Shifts - Benzinga

Quick Summary:

Nvidia Corp’s (NASDAQ:NVDA) demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (NYSE:TSM) remains robust despite its evolving technology requirements, Reuters cites Nvidia chief Jensen Huang in response to its order cut plans.

Huang voiced plans to employ Chip-On-Wafer-On-Substrate-L (CoWoS-L) for its Blackwell transition and gradually ramp up capacity into the technology despite depending on CowoS-S for its Hopper artificial intelligence (AI) chip.

For context, Nvidia has relied mainly on CoWoS-S to combine its AI chips.