Malaysia's FusionAP Lands $2M Funding to Pioneer Advanced Chip Packaging Tech

Malaysia's FusionAP has secured $2 million in funding to advance its semiconductor packaging capabilities.

The investment comes from Vertex Ventures Southeast Asia & India and Southern Capital Group, supporting expansion in a critical tech sector.

Leadership from Industry Veterans

Led by Ooi Teng Chow, a former Intel executive who built advanced packaging operations in Malaysia, FusionAP draws on expertise from ex-Intel and TSMC leaders.

The team includes Peter Chavart, ex-General Manager at Intel's Disaggregation Manufacturing Organization, ensuring deep technical know-how.

The funds will fuel engineering, R&D, intellectual property development, and pilot production for outsourced semiconductor assembly and test services.

Key Role in National Consortium

As a founding member of the Malaysia Advanced Packaging Consortium (MAPC), alongside Inari Amertron, Pentamaster, NSW Automation, and SkyeChip, FusionAP drives ecosystem growth.

This effort aligns with a RM92 million government R&D grant, matched by industry, aiming for advanced 2.5D and 3D packaging mastery within two years.

Malaysia's Semiconductor Ambitions

Malaysia, handling 13% of global back-end processing, seeks to climb the value chain amid surging demand for AI and high-performance chips.

The funding bolsters supply chain diversification, reducing risks from U.S.-China tensions and attracting firms like Intel and TSMC to expand locally.

By focusing on advanced packaging, FusionAP could enable smaller, faster chips essential for smartphones, electric vehicles, and data centers.

For everyday consumers, this means more affordable, efficient gadgets powered by homegrown innovation from Southeast Asia.

Looking ahead, success here positions Malaysia as a high-tech hub, fostering jobs and spurring further investments in the region.