Korea to inject $200-mn into semiconductor packaging R&D

Quick Summary:

To do so, its advanced packaging team will vertically interconnect HBM chips produced at its memory business division with GPUs assembled for fabless companies by its foundry unit.3D packaging reduces power consumption and processing delays, improving the quality of electrical signals of semiconductor chipsCurrently, HBM chips are horizontally connected with a GPU on a silicon interposer under the 2.5D packaging process.

South Korean will inject 274.4 billion won ($200 million) into a state-run research and development project for semiconductor packaging technology, a key to producing high-performance and low-power chips essential for artificial intelligence applications.

To meet the growing demand for high-end chips such as high bandwidth memory (HBM) amid the AI boom, chipmakers focus on improving back-end processing or packaging technology as semiconductor miniaturization has reached its physical limits.

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Category: Economy

Markets: South KoreaChinaIndiaTaiwan

Topics: Memory Semiconductor Project Billion Market Process Advanced Chips 2022 According Packaging

Source Website Secure: Yes (HTTPS)

News Sentiment: Neutral

Fact Checked: Legitimate

Article Type: News Report

Published On: 2024-06-26 @ 17:28:21 (2 days ago)

News Timezone: GMT +8:00

News Source URL: kedglobal.com

Language: English

Article Length: 338 words

Reading Time: 2 minutes read

Sentences: 24 lines

Sentence Length: 15 words per sentence (average)

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Copyright Owner: © Korea Economic Daily

News ID: 21392807

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