Japan’s 2 Trillion Yen AI Stimulus

Quick Summary:

Tokyo is poised to roll out a long-awaited stimulus package that will enable Japanese firms to gain global share in the fields of semiconductors and artificial intelligence.

The package will attract its coalition partners to reach a series of goals: to produce 2nm AI-enabled chips by 2027, establish a fully automated chip production facility by 2028, train 20,000-plus engineers in cutting-edge semiconductor designing, and bypass tech hurdles by adopting new architectures like Gate-All-Around (GAA) transistors instead of traditional FinFET designs.

While the Japanese government focuses on the expansion of next-gen tech inside the country, keiretsu groups, an interconnected network of Japanese companies, prefer to seek profits outside of the domestic market.

---

More Pictures

---

Read Quick SummarySave Time

or

Article Details

Author / Journalist: Shashank S. Patel

Category: Economy

Markets: United StatesBangladeshCanadaChinaIndiaJapanKazakhstanSouth KoreaKyrgyzstanOmanPakistanSri LankaTaiwan

Topics: Japan Japan’s Japanese Production Next-gen Package Tech Semiconductor Government Markets Stimulus

Source Website Secure: Yes (HTTPS)

News Sentiment: Neutral

Fact Checked: Legitimate

Article Type: News Report

Published On: 2024-11-16 @ 03:37:00 (23 hours ago)

News Timezone: GMT +8:00

News Source URL: thediplomat.com

Language: English

Article Length: 3044 words

Reading Time: 17 minutes read

Sentences: 129 lines

Sentence Length: 24 words per sentence (average)

Platforms: Desktop Web, Mobile Web, iOS App, Android App

Copyright Owner: © The Diplomat

News ID: 23615823

View Article Analysis

About The Diplomat

Main Topics: Economy

Official Website: thediplomat.com

Update Frequency: 2 posts per day

Year Established: 2001

Headquarters: United States

News Last Updated: 1 days ago

Coverage Areas: United States

Ownership: Independent Company

Publication Timezone: GMT +8:00

Content Availability: Worldwide

News Language: English

RSS Feed: Available (XML)

API Access: Available (JSON, REST)

Website Security: Secure (HTTPS)

Publisher ID: #70

Publisher Details

Frequently Asked Questions