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Japan Increases Semiconductor Funding As US Trade Policies Pressure Taiwan Semiconductor

Benzinga LogoBenzinga1w ago

Japan Increases Semiconductor Funding As US Trade Policies Pressure Taiwan Semiconductor - Benzinga

Quick Summary:

The planned financial package, which totals over 10 trillion yen (approximately $64.91 billion), aims to drive public and private investment of over 50 trillion yen by fiscal 2030, Taipei Times reports.Also Read: U.S.-Listed Chinese Stocks Sink as Trump Win Raises Tariff Worries, China Stimulus Falls Short

Bloomberg cites a draft that indicates this initiative will be part of an upcoming economic stimulus package designed to generate an estimated economic impact of 160 trillion yen.

During a recent news conference in Tokyo, Ishiba highlighted successful regional development projects, like Taiwan Semiconductor Manufacturing Co’s (NASDAQ:TSM) chip plant in Kumamoto Prefecture, as examples of the growth he aims ...

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Article Details

Author / Journalist: Anusuya Lahiri

Category: Technology

Markets:

Topics:

Source Website Secure: Yes (HTTPS)

News Sentiment: Neutral

Fact Checked: Legitimate

Article Type: News Report

Published On: 2024-11-13 @ 13:47:22 (1 weeks ago)

News Timezone: GMT +8:00

News Source URL: benzinga.com

Language: English

Article Length: 540 words

Reading Time: 3 minutes read

Sentences: 22 lines

Sentence Length: 25 words per sentence (average)

Platforms: Desktop Web, Mobile Web, iOS App, Android App

Copyright Owner: © Benzinga

News ID: 23571601

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Official Website: benzinga.com

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News Last Updated: 14 hours ago

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