Japan Increases Semiconductor Funding As US Trade Policies Pressure Taiwan Semiconductor

Quick Summary:

The planned financial package, which totals over 10 trillion yen (approximately $64.91 billion), aims to drive public and private investment of over 50 trillion yen by fiscal 2030, Taipei Times reports.Also Read: U.S.-Listed Chinese Stocks Sink as Trump Win Raises Tariff Worries, China Stimulus Falls Short

Bloomberg cites a draft that indicates this initiative will be part of an upcoming economic stimulus package designed to generate an estimated economic impact of 160 trillion yen.

During a recent news conference in Tokyo, Ishiba highlighted successful regional development projects, like Taiwan Semiconductor Manufacturing Co’s (NASDAQ:TSM) chip plant in Kumamoto Prefecture, as examples of the growth he aims ...

---

More Pictures

---

Read Quick SummarySave Time

or

Article Details

Author / Journalist: Anusuya Lahiri

Category: Technology

Markets: United StatesChinaJapanTaiwan

Topics: AI Generated Top Stories Government Tech Emerging Markets TSM Media US8740391003 Regulations Briefs Stories That Matter News Benzinga

Source Website Secure: Yes (HTTPS)

News Sentiment: Neutral

Fact Checked: Legitimate

Article Type: News Report

Published On: 2024-11-13 @ 13:47:22 (21 hours ago)

News Timezone: GMT +8:00

News Source URL: benzinga.com

Language: English

Article Length: 540 words

Reading Time: 3 minutes read

Sentences: 22 lines

Sentence Length: 25 words per sentence (average)

Platforms: Desktop Web, Mobile Web, iOS App, Android App

Copyright Owner: © Benzinga

News ID: 23571601

View Article Analysis

About Benzinga

Main Topics: Technology

Official Website: benzinga.com

Update Frequency: 20 posts per day

Year Established: 2010

Headquarters: United States

News Last Updated: 9 hours ago

Coverage Areas: United States

Ownership: Independent Company

Publication Timezone: GMT +8:00

Content Availability: Worldwide

News Language: English

RSS Feed: Available (XML)

API Access: Available (JSON, REST)

Website Security: Secure (HTTPS)

Publisher ID: #53

Publisher Details

Frequently Asked Questions