Sources: Samsung's High Bandwidth Memory (HBM) Chips Highlight Nvidia Test Failures, Due to Concerns over Heat, Power Consumption

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Sources: Samsung's High Bandwidth Memory (HBM) Chips Highlight Nvidia Test Failures, Due to Concerns over Heat, Power Consumption - Channel News Asia

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SEOUL/SINGAPORE : Samsung Electronics' latest high bandwidth memory (HBM) chips have yet to pass Nvidia's tests for use in the U.S.firm's AI processors due to heat and power consumption problems, three people briefed on the issues said.

Analysts also say that SK Hynix, which developed the first HBM chip in 2013, has spent far more time and resources on HBM research and development than Samsung over the past decade, accounting for its technological edge.

According to two of the people, the results of a recent failed test for Samsung's 8-layer and 12-layer HBM3E chips came in April.