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Chinese phone maker Vivo unveils X200 Pro with 200 MP ZEISS APO telephoto camera and 3nm Dimensity 9400 chipset

TechNode LogoTechNode1d ago

Chinese phone maker Vivo unveils X200 Pro with 200 MP ZEISS APO telephoto camera and 3nm Dimensity 9400 chipset - TechNode

Quick Summary:

On Monday, Chinese tech firm Vivo unveiled its new X200 series flagship smartphones, including the X200, X200 Pro, and X200 Pro Mini, at the National Aquatics Center in Beijing.

Vivo also announced a joint lab with Arm and collaboration with MediaTek to make a second-generation 3nm Dimensity 9400 chipset for the devices.

Context: In the second quarter of 2024, Chinese smartphone shipments hit 71.58 million units, representing a year-on-year growth of 8.9%, according to market intelligence firm IDC.


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Chinese phone maker Vivo unveils X200 Pro with 200 MP ZEISS APO telephoto camera and 3nm Dimensity 9400 chipset - TechNode (Picture 1)Chinese phone maker Vivo unveils X200 Pro with 200 MP ZEISS APO telephoto camera and 3nm Dimensity 9400 chipset - TechNode (Picture 2)Chinese phone maker Vivo unveils X200 Pro with 200 MP ZEISS APO telephoto camera and 3nm Dimensity 9400 chipset - TechNode (Picture 3)Chinese phone maker Vivo unveils X200 Pro with 200 MP ZEISS APO telephoto camera and 3nm Dimensity 9400 chipset - TechNode (Picture 4)

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Article Details

Author / Journalist: Jessie Wu

Category: Technology

Markets:

Topics:

Source Website Secure: Yes (HTTPS)

News Sentiment: Neutral

Fact Checked: Legitimate

Article Type: News Report

Published On: 2024-10-15 @ 08:46:47 (1 days ago)

News Timezone: GMT +8:00

News Source URL: technode.com

Language: English

Article Length: 205 words

Reading Time: 2 minutes read

Sentences: 17 lines

Sentence Length: 13 words per sentence (average)

Platforms: Desktop Web, Mobile Web, iOS App, Android App

Copyright Owner: © TechNode

News ID: 23086093

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Official Website: technode.com

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News Last Updated: 1 days ago

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