Broadcom Advances Optical Connectivity for AI Infrastructure with Industry-Leading Solutions at OFC 2025

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Broadcom showcases optical interconnect solutions for next generation AI clusters; Highlights path to 200TPALO ALTO, Calif., March 31, 2025 (GLOBE NEWSWIRE) -- Broadcom Inc.(NASDAQ: AVGO) today announced the expansion of its portfolio of optical interconnect solutions to enable AI infrastructure.

Our portfolio of optical interconnect solutions, highlighted at OFC 2025, paves the way to 200T by addressing the performance, power, and scalability challenges of AI clusters.” In addition, Broadcom is collaborating with more than 15 partners to demonstrate a wide array of its industry-leading solutions across the show floor.

At OFC, Broadcom is showcasing a wide range of novel technologies underscoring our commitment to developing cutting-edge solutions for AI infrastructure: XPU-CPO: Industry’s first 6.4-Tbps optics attach for custom AI accelerator (XPU) enabling high bandwidth, long reach scale-up fabric connectivity for AI servers.

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Author / Journalist: Broadcom Inc.

Category: Technology

Markets: China

Topics: US11135F1012 Nasdaq:AVGO

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Published On: 2025-03-31 @ 13:00:00 (2 days ago)

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