Beijing plans 12-inch wafer fab, pouring US$4.6 billion into state-backed chip project

Quick Summary:

Beijing Yandong Microelectronics will take a controlling position with a 25 per cent stake, while other investors include display maker BOE Technology.

BOE Technology is one of China’s largest display and is a supplier to tech firms that include Apple.

Collectively, the shareholders will contribute 20 billion yuan, with the remaining funding to be sourced from debt financing.

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Article Details

Author / Journalist: Wency Chen

Category: Technology

Markets: Hong KongChina

Topics: Cent Beijing Billion Include China’s Project Plans Wafer Ydme Filing Yuan

Source Website Secure: Yes (HTTPS)

News Sentiment: Neutral

Fact Checked: Legitimate

Article Type: News Report

Published On: 2024-11-16 @ 16:30:17 (6 days ago)

News Timezone: GMT +8:00

News Source URL: scmp.com

Language: English

Article Length: 253 words

Reading Time: 2 minutes read

Sentences: 12 lines

Sentence Length: 22 words per sentence (average)

Platforms: Desktop Web, Mobile Web, iOS App, Android App

Copyright Owner: © SCMP

News ID: 23764717

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